| 1. | Test method for measuring diameter of semiconductor wafers
测量半导体垫片直径的试验方法 |
| 2. | System dynamics based release policy for semiconductor wafer fabs
基于系统动力学的半导体生产线投料策略 |
| 3. | Scheduling rule for batch processing machines of semiconductor wafer fabrication facilities
半导体生产线批加工设备调度规则 |
| 4. | A circuit consisting of two or more semiconductor wafers , each containing a single element
一种由两个或多个半导体晶圆片组成的电路，每个晶片包含一个单独的元件。 |
| 5. | Determining effective adhesion of photoresist to hard - surface photomask blanks and semiconductor wafers during etching
测定在蚀刻期间光致抗蚀剂同硬表面光掩膜坯及半导体片的有效粘附性 |
| 6. | Testing of materials for semiconductor technology - determination of the geometric dimensions of semiconductor wafers - part 2 : testing of edge profile
半导体工艺材料的试验.半导体芯片几何尺寸的测量.第2 |
| 7. | Testing of materials for semiconductor technology - determination of the geometric dimensions of semiconductor wafers - part 1 : thickness and thickness variation
半导体工艺材料试验.半导体片几何尺寸测量.第1部分 |
| 8. | Testing of materials for semiconductor technology - determination of the geometric dimensions of semiconductor wafers - part 5 : terms of shape and flatness deviation
半导体技术试验.半导体片几何尺寸测定.第5部分:形状 |
| 9. | Based on the classification on the scheduling for semiconductor wafer lines , the modular and reconfigurable framework is proposed
摘要在分析半导体生产线调度分类的基础上，提出了组件化可重构半导体生产线调度体系结构。 |
| 10. | Testing of materials for semiconductor technology ; contactless determination of the electrical resistivity of semiconductor slices with the eddy current method ; homogeneously doped semiconductor wafers
半导体工艺材料检验.用涡流法无接触测定电阻率.均匀 |
